SMAJ

Ipp（A）：0.6-43.5
VRWM（V）：5-440V

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Glass passivated or planar junction.
Low profile package and low inductance.
Excellent clamping capability.
Repetition rate(duty cycle): 0.01%.
400W Peak Pulse power capability at 10×1000μs waveform.
Typical IR less than 1μA above 10V.
Fast response time: typically less than 1.0ps from 0V to VBR min.
High temperature soldering: 260°C/10s at terminals.
Plastic package has underwriters laboratory flammability 94V-0.
Meets MSL level 1, per J-STD-020.
For surface mounted applications in order to optimize board space.